Ball Bonding Gold Wires
Heraeus offers a wide selection of gold ball bonding wires in a full range of diameters to suit your applications,
from high-power and discrete components to high pin-count, ultra-fine pitch devices.
Wedge Bonding Gold Wires
Our wedge bonding gold wires are optimized for tail and loop consistency and provide excellent bondability
for high-frequency and opto-electronic applications.
Stud Bumping Gold Wires
Heraeus has developed gold wire products specifically for advanced stud bumping of wafers and other materials
used in flip-chip and chip-to-chip applications.